Next-Generation Silicon Design

Empowering
Silicon
Innovation

Custom ASIC and FPGA solutions engineered for performance, power efficiency, and accelerated time-to-market. From RTL to tapeout — we build the silicon that powers tomorrow.

ASIC & FPGA Design
Power Optimized
Security IP
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Tapeouts Delivered
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On-Time Delivery
Why LOGICtILES

The Difference is in the Silicon

We don't just design chips — we engineer competitive advantages for your product roadmap.

Accelerated Time-to-Market

Our proven design flows and reusable IP libraries cut development cycles by up to 40%, getting your product to market faster.

First-Pass Silicon Success

Rigorous verification methodologies and sign-off flows minimize respins — 90%+ first-pass success rate across our projects.

Silicon-Proven IP Portfolio

Leverage our library of pre-verified, production-tested IP cores to accelerate your design and reduce risk.

End-to-End Expertise

A single team covering architecture, RTL, DV, physical design, and post-silicon — no handoff gaps, full accountability.

Advanced Process Nodes

Experience across TSMC, Samsung, and GlobalFoundries nodes from 180nm to advanced FinFET below 7nm.

Power-Aware Design

Specialized expertise in low-power design techniques — clock gating, power domains, retention cells, and DVS.

Our Process

From Spec to Silicon

A structured, transparent design process that keeps you informed at every milestone.

01

Requirements & Architecture

We analyze your specifications, define the architecture, and create a detailed design plan including IP selection and process node recommendation.

02

RTL Design & Verification

Our engineers develop synthesizable RTL, followed by comprehensive UVM-based verification with full functional and code coverage closure.

03

Synthesis & Timing

Logic synthesis targeting your chosen process node, followed by timing analysis, optimization, and formal equivalence checking.

04

Physical Design & Sign-off

Floorplanning, place & route, power grid analysis, DRC/LVS clean layouts, and full PVT corner sign-off for silicon readiness.

05

Tapeout & Post-Silicon

GDS-II delivery, foundry coordination, post-silicon bring-up support, and test program development for production screening.

Ready to Build Your Next Chip?

Let's Turn Your Vision
Into Silicon

Whether you're designing your first ASIC or scaling an existing architecture, our team is ready to deliver silicon you can bet your product on.